Verified Job
Engineering - Architecture
Package Device Product Engineer – PDPE
Engineering - Architecture
#740743
Remote / WFH
Best NanoTech · Ahmedabad, Gujarat ·
Job Description
Job description
Package Device Product Engineer PDPE
Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Employment Type: Full-Time
Experience: 6 12 Years
Industry: Semiconductor / ATMP / OSAT / Memory Products
Role Overview
We are looking for a Package Device Product Engineer to support semiconductor package development, qualification, new-product introduction and high-volume manufacturing. The role will serve as a technical interface between product engineering, packaging, assembly, test, quality, reliability and manufacturing teams.
The engineer will analyse product and package performance, resolve yield and reliability issues, manage product qualifications and drive stable transfer of DRAM, NAND or other semiconductor products into volume production.
Key Responsibilities
• Own package and device-product engineering activities from qualification through high-volume manufacturing.
• Support new package and product introduction, characterization, validation and production release.
• Develop product qualification plans in collaboration with package, test, quality and reliability teams.
• Evaluate electrical, thermal, mechanical and reliability performance of semiconductor packages.
• Analyse assembly, test and final-product yield data to identify performance gaps and failure trends.
• Lead technical investigations into package-, device-, material- and process-related failures.
• Coordinate failure analysis using electrical test data, microscopy, X-ray and physical-analysis results.
• Drive root-cause analysis and corrective actions for yield loss, reliability failures and customer returns.
• Establish product limits, specifications, guard bands and manufacturing controls.
• Support package-process changes, material changes, equipment changes and supplier qualifications.
• Manage engineering lots, qualification builds, split lots and experimental evaluations.
• Partner with assembly and test teams to improve product yield, quality, cost and cycle time.
• Monitor product-health indicators and initiate action for abnormal trends or manufacturing excursions.
• Support product correlation across test platforms, manufacturing lines and production sites.
• Lead product-change qualification and engineering change-control activities.
• Prepare technical reports, qualification summaries and manufacturing-release documentation.
• Support customer-quality, audit and product-reliability requirements.
• Provide technical guidance to junior engineers and cross-functional production teams.
Required Qualifications
• Bachelor s or Master s degree in Electronics, Electrical, Materials, Mechanical, Semiconductor, Microelectronics Engineering or a related discipline.
• 6 12 years of experience in semiconductor product engineering, package engineering, assembly and test, ATMP, OSAT or IDM backend manufacturing.
• Strong understanding of semiconductor packaging, assembly, electrical testing and product qualification.
• Hands-on experience with new-product introduction and transfer into high-volume manufacturing.
• Demonstrated experience in yield analysis, failure analysis and root-cause investigation.
• Knowledge of semiconductor package-reliability mechanisms and qualification methodologies.
• Experience analysing electrical, process, test and manufacturing data.
• Ability to work with global engineering, supplier, manufacturing and customer-quality teams.
• Willingness to support production escalations in a 24 7 manufacturing environment.
Technical Skills Package and Product Engineering
• Semiconductor package development
• Device-product engineering
• Package and product qualification
• Product characterization
• New-product introduction
• Manufacturing release
• Product change qualification
• Engineering lot management
• Product lifecycle support
• High-volume manufacturing ramp
Semiconductor Packaging
• Die preparation and die attach
• Wire bonding
• Flip-chip interconnect
• Underfill and encapsulation
• Molding
• Package singulation
• Substrates and leadframes
• BGA, FBGA, LGA or QFN packages
• Multi-die and stacked-die packages
• Package inspection
Product and Yield Analysis
• Electrical test data analysis
• Assembly and final-test yield
• Bin and failure-mode analysis
• Statistical yield monitoring
• Product-health monitoring
• Wafer-map and lot-history analysis
• Correlation and guard-band analysis
• Defect and excursion trending
• Cost and cycle-time improvement
Failure Analysis
• Root-cause analysis
• 8D problem-solving
• Fault Tree Analysis
• Optical microscopy
• X-ray inspection
• Scanning Acoustic Microscopy
• Cross-section analysis
• Decapsulation
• SEM/EDS
• Electrical failure analysis
Reliability and Qualification
• JEDEC qualification requirements
• Temperature cycling
• HTOL
• HAST/uHAST
• MSL and preconditioning
• Thermal shock
• High-temperature storage
• Board-level reliability
• Package warpage and mechanical integrity
• Qualification-data analysis
Statistical and Quality Tools
• Design of Experiments
• Statistical Process Control
• Process Capability Analysis
• Measurement System Analysis
• FMEA
• Control plans
• CAPA
• JMP, Minitab or equivalent tools
#LI-SD1
Package Device Product Engineer PDPE
Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Employment Type: Full-Time
Experience: 6 12 Years
Industry: Semiconductor / ATMP / OSAT / Memory Products
Role Overview
We are looking for a Package Device Product Engineer to support semiconductor package development, qualification, new-product introduction and high-volume manufacturing. The role will serve as a technical interface between product engineering, packaging, assembly, test, quality, reliability and manufacturing teams.
The engineer will analyse product and package performance, resolve yield and reliability issues, manage product qualifications and drive stable transfer of DRAM, NAND or other semiconductor products into volume production.
Key Responsibilities
• Own package and device-product engineering activities from qualification through high-volume manufacturing.
• Support new package and product introduction, characterization, validation and production release.
• Develop product qualification plans in collaboration with package, test, quality and reliability teams.
• Evaluate electrical, thermal, mechanical and reliability performance of semiconductor packages.
• Analyse assembly, test and final-product yield data to identify performance gaps and failure trends.
• Lead technical investigations into package-, device-, material- and process-related failures.
• Coordinate failure analysis using electrical test data, microscopy, X-ray and physical-analysis results.
• Drive root-cause analysis and corrective actions for yield loss, reliability failures and customer returns.
• Establish product limits, specifications, guard bands and manufacturing controls.
• Support package-process changes, material changes, equipment changes and supplier qualifications.
• Manage engineering lots, qualification builds, split lots and experimental evaluations.
• Partner with assembly and test teams to improve product yield, quality, cost and cycle time.
• Monitor product-health indicators and initiate action for abnormal trends or manufacturing excursions.
• Support product correlation across test platforms, manufacturing lines and production sites.
• Lead product-change qualification and engineering change-control activities.
• Prepare technical reports, qualification summaries and manufacturing-release documentation.
• Support customer-quality, audit and product-reliability requirements.
• Provide technical guidance to junior engineers and cross-functional production teams.
Required Qualifications
• Bachelor s or Master s degree in Electronics, Electrical, Materials, Mechanical, Semiconductor, Microelectronics Engineering or a related discipline.
• 6 12 years of experience in semiconductor product engineering, package engineering, assembly and test, ATMP, OSAT or IDM backend manufacturing.
• Strong understanding of semiconductor packaging, assembly, electrical testing and product qualification.
• Hands-on experience with new-product introduction and transfer into high-volume manufacturing.
• Demonstrated experience in yield analysis, failure analysis and root-cause investigation.
• Knowledge of semiconductor package-reliability mechanisms and qualification methodologies.
• Experience analysing electrical, process, test and manufacturing data.
• Ability to work with global engineering, supplier, manufacturing and customer-quality teams.
• Willingness to support production escalations in a 24 7 manufacturing environment.
Technical Skills Package and Product Engineering
• Semiconductor package development
• Device-product engineering
• Package and product qualification
• Product characterization
• New-product introduction
• Manufacturing release
• Product change qualification
• Engineering lot management
• Product lifecycle support
• High-volume manufacturing ramp
Semiconductor Packaging
• Die preparation and die attach
• Wire bonding
• Flip-chip interconnect
• Underfill and encapsulation
• Molding
• Package singulation
• Substrates and leadframes
• BGA, FBGA, LGA or QFN packages
• Multi-die and stacked-die packages
• Package inspection
Product and Yield Analysis
• Electrical test data analysis
• Assembly and final-test yield
• Bin and failure-mode analysis
• Statistical yield monitoring
• Product-health monitoring
• Wafer-map and lot-history analysis
• Correlation and guard-band analysis
• Defect and excursion trending
• Cost and cycle-time improvement
Failure Analysis
• Root-cause analysis
• 8D problem-solving
• Fault Tree Analysis
• Optical microscopy
• X-ray inspection
• Scanning Acoustic Microscopy
• Cross-section analysis
• Decapsulation
• SEM/EDS
• Electrical failure analysis
Reliability and Qualification
• JEDEC qualification requirements
• Temperature cycling
• HTOL
• HAST/uHAST
• MSL and preconditioning
• Thermal shock
• High-temperature storage
• Board-level reliability
• Package warpage and mechanical integrity
• Qualification-data analysis
Statistical and Quality Tools
• Design of Experiments
• Statistical Process Control
• Process Capability Analysis
• Measurement System Analysis
• FMEA
• Control plans
• CAPA
• JMP, Minitab or equivalent tools
#LI-SD1
