Verified Job
Hardware / Network Engineer
Sr. Power Electronics Hardware Engineer
Hardware / Network Engineer
#4895
Remote / WFH
Job Description
Full job description
About Odys
Our mission at Odys is simple - we build safe, sustainable aircraft to cut travel time in half on the world's busiest corridors. Our flagship aircraft Alta enables travelers to skip the big-airport hassle by using city helipads and local airports to connect cities less than 1,000 miles apart (approx 40% of flights). And on average cut CO2 by 76% on tens of billions of flight miles globally.
To get there, we start with our UAV called Laila for commercial logistics, medical transport, humanitarian aid, disaster relief, and defense missions. We’re deploying aircraft with launch partners (Fiji Airways, Honeywell, Aramex, US Navy) beginning in 2026 and already have firm orders for aircraft under contract.
We’re a team of expert engineers from deep tech and aerospace that focus on fast iterations loops (completed transition flight faster than our peers) combined with mastery of the aircraft certification process. Previously, our team developed custom drones, brought multiple automotive platforms into production, and electrified transportation vehicles that magnetically levitate, that roll, that fly. Together, we’ve been learning, developing, building, testing, and preparing for this challenge our entire lives.
Odys Aviation is at the forefront of developing hybrid-electric aircraft to enable sustainable regional air travel. As the Sr. Power Electronics Hardware Engineer, you will be responsible for the design and development of our SiC-based propulsion power electronics - motor drives, active rectifiers, and DC/DC converters - supporting both the Laila (UAV) and Alta (Hybrid-electric VTOL) programs.
This role focuses on hardware design and physical realization. You will be tasked with architecting and delivering high-power-density SiC converter stages from concept through flight hardware, including schematic capture, PCB layout, magnetics, gate-drive and protection circuitry, thermal management, and EMI mitigation. Control algorithms, embedded firmware, and HIL infrastructure will remain with peer engineers; your responsibility is to deliver hardware that meets electrical, thermal, mechanical, and certification targets, and that enables the control system to extract full performance.
The primary deliverable is a propulsion power electronics stack that achieves aerospace-grade reliability, hits aggressive power-density and efficiency targets, and is manufacturable, testable, and robust under the full envelope of flight conditions.
Responsibilities
Architect and design SiC-MOSFET-based motor drives, active rectifiers, and DC/DC converters operating at switching frequencies greater than 20–40 kHz, with focus on power density, efficiency, and reliability for airborne applications.
Lead schematic capture and PCB layout (Altium, Cadence, or equivalent) for high-voltage, high-current power stages, including controlled-impedance routing, creepage and clearance per aerospace standards, and partitioning of power, signal, and gate-drive domains.
Design gate-drive circuits tailored to SiC device physics, including isolated drivers, dv/dt and di/dt management, desat and short-circuit protection, miller-clamp strategies, and dead-time selection in coordination with the controls engineer.
Design magnetic components - DC-link inductors, common-mode and differential-mode chokes, current sensors, and isolation transformers - including core selection, winding strategy, loss budgeting, and saturation analysis for high-frequency operation.
Develop DC-link architecture and capacitor banks, including ripple-current budgeting, ESR/ESL management, lifetime analysis, and pre-charge/discharge circuitry.
Lead thermal design of converter assemblies, including heatsink and cold-plate selection, junction-to-coolant thermal stack-up, transient thermal analysis, and coordination with mechanical engineering on cooling integration.
Design EMI/EMC mitigation at the hardware level - input/output filters, shielding strategy, grounding architecture, and layout-level techniques - to meet DO-160 conducted and radiated emissions requirements.
About Odys
Our mission at Odys is simple - we build safe, sustainable aircraft to cut travel time in half on the world's busiest corridors. Our flagship aircraft Alta enables travelers to skip the big-airport hassle by using city helipads and local airports to connect cities less than 1,000 miles apart (approx 40% of flights). And on average cut CO2 by 76% on tens of billions of flight miles globally.
To get there, we start with our UAV called Laila for commercial logistics, medical transport, humanitarian aid, disaster relief, and defense missions. We’re deploying aircraft with launch partners (Fiji Airways, Honeywell, Aramex, US Navy) beginning in 2026 and already have firm orders for aircraft under contract.
We’re a team of expert engineers from deep tech and aerospace that focus on fast iterations loops (completed transition flight faster than our peers) combined with mastery of the aircraft certification process. Previously, our team developed custom drones, brought multiple automotive platforms into production, and electrified transportation vehicles that magnetically levitate, that roll, that fly. Together, we’ve been learning, developing, building, testing, and preparing for this challenge our entire lives.
Odys Aviation is at the forefront of developing hybrid-electric aircraft to enable sustainable regional air travel. As the Sr. Power Electronics Hardware Engineer, you will be responsible for the design and development of our SiC-based propulsion power electronics - motor drives, active rectifiers, and DC/DC converters - supporting both the Laila (UAV) and Alta (Hybrid-electric VTOL) programs.
This role focuses on hardware design and physical realization. You will be tasked with architecting and delivering high-power-density SiC converter stages from concept through flight hardware, including schematic capture, PCB layout, magnetics, gate-drive and protection circuitry, thermal management, and EMI mitigation. Control algorithms, embedded firmware, and HIL infrastructure will remain with peer engineers; your responsibility is to deliver hardware that meets electrical, thermal, mechanical, and certification targets, and that enables the control system to extract full performance.
The primary deliverable is a propulsion power electronics stack that achieves aerospace-grade reliability, hits aggressive power-density and efficiency targets, and is manufacturable, testable, and robust under the full envelope of flight conditions.
Responsibilities
Architect and design SiC-MOSFET-based motor drives, active rectifiers, and DC/DC converters operating at switching frequencies greater than 20–40 kHz, with focus on power density, efficiency, and reliability for airborne applications.
Lead schematic capture and PCB layout (Altium, Cadence, or equivalent) for high-voltage, high-current power stages, including controlled-impedance routing, creepage and clearance per aerospace standards, and partitioning of power, signal, and gate-drive domains.
Design gate-drive circuits tailored to SiC device physics, including isolated drivers, dv/dt and di/dt management, desat and short-circuit protection, miller-clamp strategies, and dead-time selection in coordination with the controls engineer.
Design magnetic components - DC-link inductors, common-mode and differential-mode chokes, current sensors, and isolation transformers - including core selection, winding strategy, loss budgeting, and saturation analysis for high-frequency operation.
Develop DC-link architecture and capacitor banks, including ripple-current budgeting, ESR/ESL management, lifetime analysis, and pre-charge/discharge circuitry.
Lead thermal design of converter assemblies, including heatsink and cold-plate selection, junction-to-coolant thermal stack-up, transient thermal analysis, and coordination with mechanical engineering on cooling integration.
Design EMI/EMC mitigation at the hardware level - input/output filters, shielding strategy, grounding architecture, and layout-level techniques - to meet DO-160 conducted and radiated emissions requirements.
