Verified Job
Engineering - Architecture
Principal Engineer, Annapurna Labs
Engineering - Architecture
#30879
Remote / WFH
Annapurna Labs (U.S.) Inc.
Job Description
Annapurna Labs (our organization within AWS Utility Computing) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.
We are seeking experienced Hardware Design Engineers to build the next generation of our cloud server infrastructure. Our success depends on our world-class server infrastructure; we’re handling massive scale and rapid integration of emergent technologies.
As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities
As a Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
BASIC QUALIFICATIONS
BS or MS degree in Mechanical/Thermal Engineering
10+ years industry experience in Mechanical and Thermal design of Systems
Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
3+ years of experience SoC Thermal modelling and IC package transient thermal response
Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.
PREFERRED QUALIFICATIONS
Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, CA, Cupertino - 217,800.00 - 294,700.00 USD annually
USA, TX, Austin - 189,400.00 - 256,200.00 USD annually
We are seeking experienced Hardware Design Engineers to build the next generation of our cloud server infrastructure. Our success depends on our world-class server infrastructure; we’re handling massive scale and rapid integration of emergent technologies.
As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Key job responsibilities
As a Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design including thermal solutions and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.
About the team
In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.
Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.
BASIC QUALIFICATIONS
BS or MS degree in Mechanical/Thermal Engineering
10+ years industry experience in Mechanical and Thermal design of Systems
Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
3+ years of experience SoC Thermal modelling and IC package transient thermal response
Experience with Chip package, System Mechanical & Thermal design for air-cooled and liquid-cooled systems
Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.
PREFERRED QUALIFICATIONS
Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, CA, Cupertino - 217,800.00 - 294,700.00 USD annually
USA, TX, Austin - 189,400.00 - 256,200.00 USD annually
